Wiring module
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United States of America Patent
Stats
-
May 31, 2011
Grant Date -
Dec 13, 2007
app pub date -
May 1, 2007
filing date -
May 9, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.
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