Solder-holding clips for applying solder to connectors or the like
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United States of America Patent
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Dec 17, 2002
Grant Date -
May 16, 2002
app pub date -
Jan 2, 2002
filing date -
Nov 3, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.
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