Electronic device and method for manufacturing electronic device
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United States of America Patent
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Dec 5, 2023
Grant Date -
Jan 19, 2023
app pub date -
Sep 29, 2022
filing date -
Nov 14, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacturing an electronic device includes: providing a substrate; forming a plurality of connecting pads and a plurality of conductive portions partially overlapped by the plurality of connecting pads on the substrate; forming a plurality of conductive lines on the substrate, wherein one of the plurality of conductive lines is partially overlapped with one of the plurality of conductive portions, and an insulating layer is disposed between one of the plurality of connecting pads and the one of the plurality of conductive portions; and bonding a plurality of light emitting units to the plurality of connecting pads.
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