Semiconductor manufacturing apparatus and semiconductor device manufacturing method

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United States of America Patent

PATENT NO 6549608
SERIAL NO

09538737

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Abstract

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To provide a semiconductor manufacturing apparatus and a semiconductor device manufacturing method able to form a sufficiently precise pattern by ablation. A semiconductor manufacturing apparatus comprising a light source emitting light of a first wavelength on the surface of a wafer and a mask through which at least a part of the light of the first wavelength passes and removing a material of the part of the wafer exposed by the light of the first wavelength by vaporization, wherein the light source comprises an electron beam generating means for generating an electron beam and a light emitting means for emitting light of a second wavelength longer than the first wavelength and wherein the light of the first wavelength is inverse Compton scattered light obtained by collision of electrons in the electron beam with photons in the light of the second wavelength causing the energy of the electrons to be given to the photons and a semiconductor device manufacturing method using the apparatus.

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Patent Owner(s)

  • SONY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kishii, Noriyuki Kanagawa, JP 41 190
Mamine, Takayoshi Kanagawa, JP 15 59
Matsuzawa, Nobuyuki Kanagawa, JP 65 235

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