Light-emitting diode device and method for fabricating the same
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United States of America Patent
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Apr 19, 2011
Grant Date -
Jan 21, 2010
app pub date -
Jul 15, 2008
filing date -
Jul 15, 2008
priority date (Note) -
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Abstract
A semiconductor device is disclosed. The semiconductor device comprises a light-emitting diode chip disposed in a cavity of a semiconductor substrate. At least two isolated outer wiring layers are disposed on the bottom surface of the semiconductor substrate and are electrically connected to the light-emitting diode chip, serving as input terminals. A lens module is adhered to the top surface of the semiconductor substrate to cap the cavity, in which the lens module comprises a molded lens and a molded fluorescent layer thereunder and the molded fluorescent layer faces the light-emitting diode chip. A method for fabricating the semiconductor devices is also disclosed.
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