Epoxy resin composition for semiconductor encapsulation and semiconductor device
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United States of America Patent
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Jun 19, 2001
Grant Date -
N/A
app pub date -
Sep 30, 1999
filing date -
Dec 8, 1998
priority date (Note) -
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Abstract
An epoxy resin composition for semiconductor encpsulation, which is excellent in both storage stability and rapid curability, is disclosed. The epoxy resin composition for semiconductor encapsultion comprises (A) an epoxy resin, (B) a phenolic resin, and a combination of (C) a cure accelerator and (D) cure accelerator-containing microcapsules having a core/shell structure in which a cure accelerator as a core is encapsulated in a thermoplastic resin shell.
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