Temperature setting method of heat processing plate, temperature setting apparatus of heat processing plate, program, and computer-readable recording medium recording program thereon

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United States of America Patent

PATENT NO 8014895
APP PUB NO 20090254226A1
SERIAL NO

11721612

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwanaga, Shuji Koshi, JP 20 93
Sata, Nobuyuki Koshi, JP 19 367

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