Substrate for producing a soldering connection
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United States of America Patent
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-
Sep 18, 2007
Grant Date -
May 12, 2005
app pub date -
Sep 24, 2004
filing date -
Sep 25, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edges that symmetrically overlie portions of the soldering pad.
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Cited Art Landscape
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