Device interconnection

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6870263
SERIAL NO

09052688

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A conductor for interconnecting integrated circuit components having improved reliability. The conductor includes a liner surrounding at least three surfaces of the conductor, producing a low textured conductor. It has been found that low textured conductor results in improved electromigration lifetime.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION;SAMSUNG ELECTRONICS CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Clevenger, Lawrence A Lagrangeville, NY 715 4465
Filippi, Ronald G Wappingers Falls, NY 99 1178
Hoinkis, Mark Fishkill, NY 29 838
Hurd, Jeffery L Marlboro, NY 6 41
Iggulden, Roy C Newburgh, NY 17 244
Mehter, Ebrahim A Wappingers Falls, NY 2 8
Palm, Herbert Hoehenkirchen-Siegertsbrunn, DE 19 505
Poetzlberger, Hans W Munich, DE 4 36
Rodbell, Kenneth P Poughquag, NY 127 1614
Schnabel, Florian Wappingers Falls, NY 13 143
Weber, Stefan Fishkill, NY 84 560

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