Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board
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United States of America Patent
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Mar 30, 2004
Grant Date -
Dec 19, 2002
app pub date -
Jun 14, 2002
filing date -
Dec 27, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a method of manufacturing a contact element, provision is made of a laminated body which has an insulating film, an electrically conductive layer stacked on the insulating film, and bump holes opened. A treatment is carried out so as to remove organic materials and the like from an interior of the bump holes and/or a surface of the insulating film before bumps are formed on the bump holes. The treatment may be a plasma treatment or an X-ray irradiation.
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