Polishing slurry
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 24, 2011
Grant Date -
May 14, 2009
app pub date -
May 15, 2006
filing date -
May 17, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention discloses a polishing slurry, wherein said polishing slurry comprises a carrier and functionalized alumina grains. The polishing slurry, which comprises functionalized alumina grains having desirable dispersibility, has desirable stability and is able to lower the defect rate of the substrate surface, improve the surface quality, decrease the total metal loss and enlarge the variation range of the technical parameters.
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