Process for fabircating an integrated circuit
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United States of America Patent
Stats
-
May 14, 1996
Grant Date -
N/A
app pub date -
Mar 31, 1994
filing date -
Mar 31, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A process for fabricating devices is disclosed. Numerous devices are formed on a substrate. The substrate is then placed on an adhesive tape mounted on a dicing ring. The devices are then separated into individual chips by dicing the substrate. Prior to dicing, the substrate is coated with a material that is relatively insoluble in water. After the substrate is diced, the coating is removed by rinsing the substrate with an organic solvent in which the material is substantially soluble. The organic solvent dissolves the coating but does not dissolve the adhesive on the tape or otherwise adversely effect the adhesion between the tape and the substrate.
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