Gas recirculation flow control method and apparatus for use in vacuum system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6782907
APP PUB NO 20020134439A1
SERIAL NO

10101923

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A gas recirculation flow control method and apparatus for use in an evacuation system having a vacuum chamber into which a gas is introduced, a first vacuum pump for exhausting the gas from the vacuum chamber and reducing the pressure in the vacuum chamber to a desired pressure, a second vacuum pump for performing evacuation to lower the back pressure of the first vacuum pump below an allowable back pressure, and a gas recirculation line for returning a part of gas exhausted from the first vacuum pump to the vacuum chamber. The recirculation flow rate Q.sub.2 of the gas returning to the vacuum chamber through the gas recirculation line is controlled by adjusting the differential pressure Pd-Pc in the gas recirculation line by varying the effective pumping speed of the second vacuum pump using the following relationship: Q.sub.2 =C.times.(Pd-Pc) where: Q.sub.2 denotes the recirculation flow rate of the gas returning to the vacuum chamber through the gas recirculation line; Pc denotes the pressure in the vacuum chamber; Pd denotes the pressure in the upstream side of the gas recirculation line; and C denotes the conductance of the gas recirculation line.

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Patent Owner(s)

  • EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawasaki, Hiroyuki Tokyo, JP 55 320
Ohiwa, Tokuhisa Kanagawa, JP 47 767
Sakai, Itsuko Kanagawa, JP 30 386

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