Electroplating apparatus and method of using the same
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United States of America Patent
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-
Jun 4, 2002
Grant Date -
N/A
app pub date -
May 31, 2000
filing date -
May 31, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electroplating chamber that allows substrates such as wafers to be effectively plated with the plating surface facing upwards. A method of reducing non-uniformity in the electroplating process is also disclosed. The chamber includes a bottom and a cover. The bottom contains a sidewall, an opening on top and securing means for securing substrates into the chamber during the plating process. At least one electrode retaining element is provided having at least one first electrode extending therefrom. The electrode retaining element is movable between an operating position and a release position. The cover contains a second electrode held above the substrate by an electrode holder.
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