Importance

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Abstract

A method of fabricating a micro-electromechanical systems device that is positioned on a wafer substrate that incorporates drive circuitry includes the step of depositing a first sacrificial layer of an organic material on the wafer substrate. The first sacrificial layer is etched to define a required pattern. A layer of a conductive material is deposited on the first sacrificial layer. The layer of conductive material is etched to define a required structure and at least one subsequent sacrificial layer of organic material is deposited on the layer of conductive material. The at least one subsequent sacrificial layer is etched to define a further required pattern. A structural layer of a dielectric material is deposited on the subsequent sacrificial layer. The structural layer is etched to define a further required structure. The sacrificial layers are removed to release micro-electromechanical structures defined by the layer of conductive material and the structural layer.

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First Claim