Electromechanical device having a plurality of bundles of fibers for interconnecting two planar surfaces
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United States of America Patent
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May 22, 2007
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N/A
app pub date -
Sep 12, 2006
filing date -
Dec 20, 2005
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Abstract
According to various embodiments, exemplary interconnects and methods for interconnection are provided that can include contacts formed by fiber bundles. The exemplary interconnects can be used to form separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. In various embodiments, the exemplary interconnects can allow management of the thermal properties of the electronic devices. Exemplary interconnects can also provided reduced thickness allowing redundancy and additional compliance as desired.
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