Conductive fine particles, method for plating fine particles, and substrate structural body
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United States of America Patent
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Jun 5, 2007
Grant Date -
Nov 24, 2005
app pub date -
Apr 27, 2001
filing date -
Aug 4, 2000
priority date (Note) -
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Abstract
This invention provides a conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like. A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3.times.10.sup.-5 to 7.times.10.sup.-5 (1/K).
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