Fluid ejector having an anisotropic surface chamber etch
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United States of America Patent
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May 8, 2007
Grant Date -
Feb 9, 2006
app pub date -
Aug 4, 2004
filing date -
Aug 4, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A fluid ejecting device and method of forming same are provided. The fluid ejecting device includes a substrate having a first surface and a second surface located opposite the first surface. A nozzle plate is formed over the first surface of the substrate. The nozzle plate has a nozzle through which fluid is ejected. A drop forming mechanism is situated at the periphery of the nozzle. A fluid chamber is in fluid communication with the nozzle and has a first wall and a second wall with the first wall and the second wall being positioned at an angle relative to each other. A fluid delivery channel is formed in the substrate and extends from the second surface of the substrate to the fluid chamber. The fluid delivery channel is in fluid communication with the fluid chamber. A source of fluid impedance includes a physical structure located between the nozzle and the fluid delivery channel.
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