Importance

Loading Importance Indicators...

Abstract

A method is disclosed for patterning dual damascene interconnections in semiconductor chips through the use of a developer soluble ARC interstitial layer. This is accomplished by providing a silicon substrate having a composite layer of insulation deposited thereon whereby said composite layer comprises a first layer of dielectric separated from a second layer of dielectric by an intervening intermediate layer of silicon nitride. Then, two layers of photoresist are deposited with an intervening interstitial layer of water soluble anti-reflective coating (ARC). The ARC, having a relatively high refractive index, serves as a barrier to light so that the top layer of photoresist is first line patterned without affecting the second layer. The second layer of photoresist is next hole patterned. The hole pattern is transferred into the top dielectric layer and the intervening silicon nitride layer by etching. The line pattern in the first photoresist layer is etched into the top dielectric layer at the same time the hole pattern is transferred from the top dielectric layer into the bottom dielectric layer by the same etching process. The photoresist layers are then removed and the dual damascene structure thusly formed is filled with metal forming the metal line and hole interconnection on the semiconductor substrate.

Loading the Abstract Image...

First Claim