RTM molding method and device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7943078
APP PUB NO 20070182071A1
SERIAL NO

10589589

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An RTM molding method includes disposing a reinforcing fiber substrate in a cavity of a mold consisting of a plurality of dies, clamping the mold, and thereafter injecting resin to complete molding, characterized in that divided areas with respect to the surface direction of the reinforcing fiber substrate are assumed, each divided area is one in which injected resin expands over the entire surface in the area and can be substantially uniformly impregnated in the thickness direction of the substrate, and resin introducing paths are formed for respective assumed divided areas for introducing the injected resin into the respective divided areas; and an RTM molding device. When a relatively large molded product is to be molded, a molding step from resin injection to impregnating/curing can be implemented at high speed without generating a non-resin-flowing area, thereby enabling a high-quality molded product to be produced free from voids, etc., with a molding time shortened and production speed and volume increased.

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Patent Owner(s)

  • TORAY INDUSTRIES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwasawa, Shigeo Matsuyama, JP 7 69
Sekido, Toshihide Otsu, JP 19 249
Senba, Tatsuya Iyo-gun, JP 2 47

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