Semiconductor structure and method for semiconductor device fabrication with improved source drain epitaxy

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United States of America Patent

PATENT NO 10158017
APP PUB NO 20170373189A1
SERIAL NO

15684088

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Abstract

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A semiconductor structure includes a substrate, first gate structures and second gate structures over the substrate, third epitaxial semiconductor features proximate the first gate structures, and fourth epitaxial semiconductor features proximate the second gate structures. The first gate structures have a greater pitch than the second gate structures. The third and fourth epitaxial semiconductor features are at least partially embedded in the substrate. A first proximity of the third epitaxial semiconductor features to the respective first gate structures is smaller than a second proximity of the fourth epitaxial semiconductor features to the respective second gate structures. In an embodiment, a first depth of the third epitaxial semiconductor features embedded into the substrate is greater than a second depth of the fourth epitaxial semiconductor features embedded into the substrate.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ting-Yeh Hsinchu, TW 33 131
Hsu, Tzu-Hsiang Hsinchu County, TW 32 84
Lee, Wei-Yang Taipei, TW 218 894
Yang, Feng-Cheng Hsinchu County, TW 225 605

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