Method of fabricating a semiconductor stacked multi-package module having inverted second package
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United States of America Patent
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Jan 23, 2007
Grant Date -
Aug 3, 2006
app pub date -
Mar 10, 2006
filing date -
Oct 8, 2002
priority date (Note) -
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Abstract
A semiconductor multi-package module has stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding, and in which the upper package is inverted. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
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