Method of making polishing pad for planarization of semiconductor wafers
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United States of America Patent
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Jun 22, 2004
Grant Date -
N/A
app pub date -
Jun 12, 2002
filing date -
Jun 12, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making polishing pads used for the planarization of semiconductor wafers wherein the pad includes a polymer sleeve filled with an optical polymer to provide a window for the pad. An opaque polishing pad polymer is molded around the sleeve and window to form a large volume cake which is then cured and subdivided into a multiplicity of individual pads.
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