Copper die bumps with electromigration cap and plated solder
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United States of America Patent
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Apr 5, 2011
Grant Date -
Sep 25, 2008
app pub date -
Mar 23, 2007
filing date -
Mar 23, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the invention include apparatuses and methods relating to copper die bumps with electtomigration cap and plated solder. In one embodiment, an apparatus comprises an integrated circuit die, a plurality of copper bumps on a surface of the die, electromigration(EM) caps substantially covering a mating surface of the copper bumps capable of controlling intermetallic formation between the cooper bumps and solder, and solder plating on the EM caps capable of protecting the EM caps from oxidation prior to packaging.
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