Semiconductor package including stacked semiconductor chips and method for fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11133287
APP PUB NO 20210057379A1
SERIAL NO

16784517

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Abstract

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A semiconductor package may include: a chip stack including first to Nth semiconductor chips having first to Nth chip pads formed in active surfaces thereof, respectively, and sequentially stacked in a vertical direction such that the first to Nth chip pads are exposed, wherein N is a natural number equal to or more than 2; first to Nth vertical wires having first ends connected to the first to Nth chip pads, respectively, and extended in the vertical direction; a coating layer surrounding portions of the first to kth vertical wires, extended from the first ends, among the first to Nth vertical wires, and connection portions between the first ends of the first to kth vertical wires and the first to kth chip pads; and a molding layer covering the chip stack, surrounding the vertical wires, and covering the coating layer.

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Patent Owner(s)

  • SK HYNIX INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Jae-Min Icheon-si, KR 29 243

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