Method of forming a multilayer ceramic substrate with max-punched vias
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United States of America Patent
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May 15, 2001
Grant Date -
N/A
app pub date -
Sep 22, 1998
filing date -
Sep 22, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In the formation of multilayer ceramic substrates, greensheets are utilized which have the same pattern and number of vias punched in each greensheet. Then, selected vias may be filled with metallic paste to form the internal connections of the multilayer ceramic substrate. The remaining vias may be filled with a fugitive material or left totally unfilled. Also disclosed is the multilayer ceramic substrate produced by this method.
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