Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors
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United States of America Patent
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Dec 2, 2003
Grant Date -
N/A
app pub date -
Jul 21, 1999
filing date -
Dec 25, 1998
priority date (Note) -
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Abstract
An apparatus and method recycles the abrasive fluid or slurry effluent used in the polishing step in the manufacture of semiconductors. Agglomerations of abrasive grains built up in the slurry effluent are crushed using a mill, ultrasonic oscillation, or pressurized circulation. The slurry effluent is then regenerated and reused.
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