Apparatus and method for electrical detection and localization of shorts in metal interconnect lines
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United States of America Patent
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Feb 15, 2011
Grant Date -
N/A
app pub date -
Sep 22, 2009
filing date -
Jan 12, 2007
priority date (Note) -
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Abstract
A test structure for localizing shorts in an integrated circuit and method of testing is described. A first comb structure is formed from a first busbar and a first plurality of fingers extending from the first busbar. A second comb structure formed from a second busbar and a second plurality of fingers extending from the second busbar. The second plurality of fingers is interleaved with the first plurality of fingers. A plurality of pass gates is connected between the first plurality of fingers and the first busbar. A pass gate terminal is electrically connected to the gate electrode of each of the plurality of pass gates. When the pass gates are turned OFF thereby disconnecting the first busbar from the first plurality of fingers, voltage contrast imaging can be used to identify which of the first fingers is adjacent the short.
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