Electronic apparatus and thermal dissipating module thereof
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United States of America Patent
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Jan 13, 2009
Grant Date -
Mar 15, 2007
app pub date -
Apr 20, 2006
filing date -
Sep 15, 2005
priority date (Note) -
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Abstract
A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a first thermal conductive plate, and a second thermal conductive plate. It also can be used in an electronic apparatus with a thermal dissipating module.
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