Method and apparatus for through-body optical component attachment using laser soldering
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United States of America Patent
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Sep 30, 2003
Issued Date -
N/A
app pub date -
Dec 13, 2001
filing date -
Jun 28, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
According to an aspect of the present invention, a method for laser soldering optical components is described. In that method, a first selected material is disposed on the components to facilitate the deposition of solder. Subsequently, solder is disposed on that material and the component is aligned. A laser beam is properly focused on the solder such that the solder melts and, when the laser beam is turned off, hardens, thereby fixing the component in the desired position.
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