ARC gap for integrated circuits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4794437
SERIAL NO

06895365

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An arc gap for an integrated circuit on a surface of a substrate of semiconductor material includes a first conductive strip over and insulated from the substrate surface. A layer of an insulating material is over the first conductive strip and a second conductive strip is on the insulating layer. The insulating layer has an opening therethrough which exposes at least a portion of the first conductive strip. The second conductive strip extends to substantially the edge of the opening in the insulating layer so that the two conductive strips are exposed to each other through the opening. The two conductive strips may be portions of a metallization pattern for the integrated circuit.

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Patent Owner(s)

  • GENERAL ELECTRIC COMPANY;INTERSIL CORPORATION;RCA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Palumbo, William J Union Township, Hunterdon County, NJ 1 7

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