Antifuse interconnect between two conducting layers of a printed circuit board
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United States of America Patent
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-
Oct 5, 1999
Grant Date -
N/A
app pub date -
Jan 18, 1995
filing date -
Jan 18, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayered structure, such as a printed circuit board, includes a first conductive layer and a second conductive layer that are separated from each other by a dielectric layer. The dielectric layer is formed of a first material, such as a photoimagible polyimide and epoxy resin. The dielectric layer has a number of via holes that extend from the first conductive layer to the second conductive layer. The via holes are filled with a second material having a breakdown voltage less than a breakdown voltage of the first material included in the dielectric layer to form an antifuse. The second material in the via holes can be, for example, a conductive epoxy resin or a polymer loaded with conductive particles (also referred to as 'conductive paste').
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