Microelectronic assembly with impedance controlled wirebond and reference wirebond
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United States of America Patent
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Jan 7, 2014
Grant Date -
Jun 6, 2013
app pub date -
Aug 20, 2012
filing date -
Mar 13, 2009
priority date (Note) -
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Abstract
A microelectronic device, e.g., semiconductor chip, is connected with an interconnection element having signal contacts and reference contacts, the reference contacts being connectable to a reference potential such as ground or power. Signal conductors, e.g., signal wirebonds can be connected to device contacts of the microelectronic device, and at least one reference conductor, e.g., reference wirebond can be connected with two reference contacts. The reference wirebond can have a run extending at an at least substantially uniform spacing from an at least a substantial portion of a length of a signal conductor, e.g., signal wirebond. In such manner a desired impedance may be achieved for the signal conductor.
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