Semiconductor package including an image sensor chip and a method of fabricating the same

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United States of America Patent

PATENT NO 11824076
APP PUB NO 20220254827A1
SERIAL NO

17731022

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Abstract

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Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package may include a semiconductor chip structure, a transparent substrate disposed on the semiconductor chip structure, a dam placed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate, and an adhesive layer interposed between the dam and the semiconductor chip structure. The semiconductor chip structure may include an image sensor chip and a logic chip, which are in contact with each other, and the image sensor chip may be closer to the transparent substrate than the logic chip.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Yonghoe Bucheon-si, KR 14 10
Jo, Chajea Yongin-si, KR 46 716
Jung, Yoonha Suwon-si, KR 11 64
Lee, Chungsun Anyang-si, KR 41 802

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