Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
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United States of America Patent
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-
Nov 9, 2010
Grant Date -
Jan 10, 2008
app pub date -
Jul 31, 2007
filing date -
Jan 6, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.
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