Microelectromechanical devices and fabrication methods
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United States of America Patent
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Mar 2, 2010
Grant Date -
May 29, 2008
app pub date -
Nov 7, 2006
filing date -
Nov 7, 2006
priority date (Note) -
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Abstract
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.
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