Moveable arm assembly for a wire bonder
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United States of America Patent
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Jan 5, 2010
Issued Date -
N/A
app pub date -
Oct 8, 2007
filing date -
Oct 9, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a wedge bonding position. When the moveable arm assembly is in the ball bonding position the at least one component for the ball bonding operation is in a predetermined position for use in the ball bonding operation.
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