Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing

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United States of America Patent

PATENT NO 9837295
APP PUB NO 20140318683A1
SERIAL NO

14330536

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Abstract

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A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.

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Patent Owner(s)

  • SUSS MICROTEC LITHOGRAPHY GMBH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brennen, Michael Irasburg, US 3 10
George, Gregory Colchester, US 42 543
Johnson, Hale Jericho, US 19 187

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