Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
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United States of America Patent
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May 12, 2009
Grant Date -
Oct 30, 2008
app pub date -
Oct 5, 2005
filing date -
Nov 29, 2004
priority date (Note) -
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Abstract
A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate.
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