Printed circuit board and method of reducing crosstalk in a printed circuit board
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United States of America Patent
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-
Dec 23, 2008
Grant Date -
Oct 4, 2007
app pub date -
May 24, 2007
filing date -
Mar 2, 2004
priority date (Note) -
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Abstract
The embodiments of the present invention relate to an improved printed circuit board having additional rows of ground vias to reduce crosstalk in the board. A printed circuit board according to one embodiment of the present invention comprises a first row of vias and a second row of vias, each having a plurality of signal vias. The circuit board also comprises a plurality of rows of vias being coupled to a ground plane between the first row of signal vias and the second row of signal vias. According to one embodiment, the plurality of rows of vias being coupled to a ground plane comprise rows of vias having different sizes. Some of the vias are designed to receive a component, while others are generally smaller and designed to provide a return current path for the signal vias.
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