Semiconductor device

United States of America Patent

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Mar 29, 2011
Grant Date
Aug 13, 2009
app pub date
Nov 11, 2008
filing date
Feb 7, 2008

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Abstract

A semiconductor device which includes a first wiring with a via connected to the first wiring, a second wiring connected to the via and a dummy via disposed adjacent to the via at a distance of 100 nm or less and formed on the same layer as the via.

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Patent Owner(s)

FUJITSU SEMICONDUCTOR LIMITED

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kudo, Hiroshi	Kawasaki, JP	62	734

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Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12268712

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PATENT NO	7915733
APP PUB NO	20090200676A1
SERIAL NO	12268712
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 29, 2011	US,7915733,B2 US7915733B2	GRANTED PATENT AS SECOND PUBLICATION
August 13, 2009	US,20090200676,A1 US20090200676A1	FIRST PUBLISHED PATENT APPLICATION

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12268712

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