Modifying a semiconductor device to provide electrical parameter monitoring
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 27, 2007
Issued Date -
N/A
app pub date -
Mar 4, 2003
filing date -
Mar 4, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of modifying a semiconductor device to provide electrical parameter monitoring. The device includes a semiconductor die and a package substrate. The substrate includes a conductive plane. The die is connected to the plane via a plurality of connection structures. The method includes disconnecting a first one of the connection structures from the plane, and connecting the first connection structure to an external package connection, thereby providing a capability to monitor an electrical parameter of the die via the external package connection.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully