Bondhead lead clamp apparatus and method
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United States of America Patent
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Dec 4, 2001
Issued Date -
N/A
app pub date -
Sep 28, 1999
filing date -
Feb 6, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.
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