Power conditioning substrate stiffener
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United States of America Patent
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May 27, 2003
Grant Date -
N/A
app pub date -
Feb 24, 2000
filing date -
Feb 24, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Utilization of the 'dead space' previously occupied by a metal stiffener in an integrated circuit package as a location for power conditioning and converting mechanisms such as de-coupling capacitors and planar transformers.
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