Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11987731
APP PUB NO 20210284888A1
SERIAL NO

17267351

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G′), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A′) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

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Patent Owner(s)

  • DOW TORAY CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Itoh, Maki Ichihara, JP 35 261
Nakamura, Akihiro Ichihara, JP 196 1858
Suto, Michitaka Ichihara, JP 55 361

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