Structure design for minimizing on-chip interconnect inductance

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May 31, 2011
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Aug 5, 2010
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Apr 14, 2010
filing date
Mar 21, 2007

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Abstract

A semiconductor device comprising a signal line and ground line is disclosed. The signal line comprises an opening and at least a portion of the ground line is in the opening in the signal line.

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TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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H01P:WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF ....

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Inventor Name	Address	# of filed Patents	Total Citations
Chen, Hsien-Wei	Tainan County, TW	909	8139
Chen, Hsueh-Chung	Taipei County, TW	165	1089
Jeng, Shin-Puu	Hsinchu County, TW	754	15781

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Structure design for minimizing on-chip interconnect inductance

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United States of America Patent

12759836

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PATENT NO	7952453
APP PUB NO	20100194501A1
SERIAL NO	12759836
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 31, 2011	US,7952453,B2 US7952453B2	GRANTED PATENT AS SECOND PUBLICATION
August 05, 2010	US,20100194501,A1 US20100194501A1	FIRST PUBLISHED PATENT APPLICATION

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12759836

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