Spherical drive assembly for chemical mechanical planarization
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United States of America Patent
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-
Jan 28, 2003
Grant Date -
N/A
app pub date -
Oct 26, 2000
filing date -
Oct 27, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object comprises a pad having a polishing surface to be placed on a target surface of the object to be polished. A pad drive member is connected to the pad to move the pad relative to the object to change a position of the polishing surface of the pad on the target surface of the object. A drive support is movably coupled with the pad drive member to support the pad drive member for rotation relative to the drive support around a pivot point which is disposed substantially on the target surface of the object during polishing.
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