Heat radiation package and semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8368206
APP PUB NO 20090039379A1
SERIAL NO

12187641

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Abstract

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A heat radiation package of the present invention includes a substrate in an upper surface side of which recess portion is provided, embedded wiring portion which is filled in the recess portion of the substrate and on which semiconductor element which generates a heat is mounted, and a heat sink connected to a lower surface side of the substrate. The substrate is made of silicon, ceramics, or insulating resin.

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Patent Owner(s)

  • SHINKO ELECTRIC INDUSTRIES CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higashi, Mitsutoshi Nagano, JP 160 6346
Murayama, Kei Nagano, JP 161 4424
Shiraishi, Akinori Nagano, JP 80 2250
Sunohara, Masahiro Nagano, JP 136 4970
Taguchi, Yuichi Nagano, JP 231 9326

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