Lead frame with waffled front and rear surfaces
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United States of America Patent
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May 11, 1999
Grant Date -
N/A
app pub date -
Jun 11, 1997
filing date -
Sep 5, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A surface mount semiconductor package includes a semiconductor device, a metal pad on which the semiconductor device is mounted, and a housing formed of a flowable material which bonds to the metal pad and encapsulates the semiconductor device when cured, where the metal pad includes a waffled surface opposite the surface on which the semiconductor device is mounted for accepting solder between the metal pad and a substrate and for permitting solder wetting therebetween.
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