Yield prediction and statistical process control using predicted defect related yield loss
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United States of America Patent
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Dec 17, 2002
Grant Date -
N/A
app pub date -
Apr 27, 1999
filing date -
Apr 27, 1999
priority date (Note) -
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Abstract
In accordance with the present invention, a method, which may be implemented by employing a program storage device, for determining yield loss for a device includes the steps of determining killing probabilities corresponding to values of inspection parameters based on historic inspection information, determining defects on the device and ordering the defects by classifying the defects according to the inspection parameters. The defects adopt the killing probabilities associated with the same values of the inspection parameters. The method further includes the step of calculating a predicted yield loss based on the defects and the adopted killing probabilities. The method further includes the step of applying statistical process control to the predicted yield loss for all in-line inspection (process) steps.
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